| Polymer-based Hybrid Integrated Photonic Devices for Silicon On-chip Modulation and Board-level Optical Interconnects X Zhang, A Hosseini, X Lin, H Subbaraman, RT Chen | 135* | |
| Nano-bio-electronic, Photonic and MEMS Packaging CP Wong, KS Moon, YG Li Springer, 2010 | 110 | 2010 |
| Low-cost board-to-board optical interconnects using molded polymer waveguide with 45 degree mirrors and inkjet-printed micro-lenses as proximity vertical coupler X Lin, A Hosseini, X Dou, H Subbaraman, RT Chen Opt. Express 21 (1), 60-69, 2013 | 51 | 2013 |
| Polymeric waveguides with embedded micro-mirrors formed by Metallic Hard Mold X Dou, X Wang, H Huang, X Lin, D Ding, DZ Pan, RT Chen Opt. Express 18 (1), 378-385, 2010 | 48 | 2010 |
| Ultraviolet imprinting and aligned ink-jet printing for multilayer patterning of electro-optic polymer modulators X Lin, T Ling, H Subbaraman, X Zhang, K Byun, LJ Guo, RT Chen Optics Letters 38 (10), 1597-1599, 2013 | 45* | 2013 |
| Printable thermo-optic polymer switches utilizing imprinting and ink-jet printing X Lin, T Ling, H Subbaraman, LJ Guo, RT Chen Optics express 21 (2), 2110-2117, 2013 | 35 | 2013 |
| Highly flexible polymeric optical waveguide for out-of-plane optical interconnects X Dou, X Wang, X Lin, D Ding, DZ Pan, RT Chen Opt. Express 18 (15), 16227-16233, 2010 | 29 | 2010 |
| Metrology and instrumentation challenges with high-rate, roll-to-roll manufacturing of flexible electronic systems H Subbaraman, X Lin, X Xu, A Dodabalapur, LJ Guo, RT Chen SPIE NanoScience+ Engineering, 846603-846603-8, 2012 | 25 | 2012 |
| UV surface exposure for low temperature hydrophilic silicon direct bonding X Lin, G Liao, Z Tang, T Shi Microsystem Technologies 15 (2), 317-321, 2009 | 22 | 2009 |
| Photolithography-free polymer optical waveguide arrays for optical backplane bus X Dou, AX Wang, X Lin, RT Chen Opt. Express 19 (15), 14403-14410, 2011 | 21 | 2011 |
| 基于 GPRS 的嵌入式智能家居终端的设计与实现 王艺， 刘方， 林晓辉 微计算机信息, 23-25, 2007 | 21 | 2007 |
| A 3µm channel, ink-jet printed CNT-TFT for phased array antenna applications K Byun, H Subbaraman, X Lin, X Xu, RT Chen Wireless and Microwave Circuits and Systems (WMCS), 2013 Texas Symposium on, 1-3, 2013 | 16 | 2013 |
| Nickel electroplating for nanostructure mold fabrication X Lin, X Dou, X Wang, RT Chen Journal of Nanoscience and Nanotechnology 11 (8), 7006-7010, 2011 | 16 | 2011 |
| Effect of surface characteristic on room-temperature silicon direct bonding G Liao, T Shi, X Lin, Z Ma Sensors and Actuators A: Physical 158 (2), 335-341, 2010 | 15 | 2010 |
| Optical bus waveguide metallic hard mold fabrication with opposite 45 micro-mirrors X Dou, AX Wang, X Lin, H Huang, RT Chen OPTO, 76070P-76070P-6, 2010 | 15 | 2010 |
| Surface roughness modeling for silicon direct bonding G Liao, X Lin, L Nie, T Shi Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 11 | 2011 |
| Polymer optical waveguide-based bi-directional optical bus architecture for high-speed optical backplane X Lin, X Dou, AX Wang, RT Chen SPIE OPTO, 826709-826709-8, 2012 | 7 | 2012 |
| Ultraviolet exposure enhanced silicon direct bonding G Liao, X Zhang, X Lin, C Ma, L Nie, T Shi Frontiers of Mechanical Engineering in China 5 (1), 87-92, 2010 | 6 | 2010 |
| 硅片低温键合湿化学法表面活化工艺研究 林晓辉， 廖广兰， 史铁林， 聂磊 传感技术学报 5, 88-9, 2006 | 6 | 2006 |
| Printable EO Polymer Modulators H Subbaraman, X Lin, T Ling, X Zhang, LJ Guo, RT Chen CLEO: Science and Innovations, 2013 | 5 | 2013 |
