| Advanced signal integrity for high-speed digital designs SH Hall, HL Heck John Wiley & Sons, 2011 | 755 | 2011 |
| Computational and experimental study of a microwave electromagnetic bandgap structure with waveguiding defect for potential use as a bandpass wireless interconnect JJ Simpson, A Taflove, JA Mix, H Heck IEEE Microwave and Wireless components letters 14 (7), 343-345, 2004 | 80 | 2004 |
| A practical method for modeling PCB transmission lines with conductor surface roughness and wideband dielectric properties T Liang, S Hall, H Heck, G Brist 2006 IEEE MTT-S International Microwave Symposium Digest, 1780-1783, 2006 | 76 | 2006 |
| Substrate integrated waveguides optimized for ultrahigh-speed digital interconnects JJ Simpson, A Taflove, JA Mix, H Heck IEEE Transactions on microwave theory and Techniques 54 (5), 1983-1990, 2006 | 74 | 2006 |
| Modeling and mitigating AC common mode conversion in multi-Gb/s differential printed circuit boards H Heck, S Hall, B Horine, T Liang Electrical Performance of Electronic Packaging-2004, 29-32, 2004 | 32 | 2004 |
| Type-C retimer state machine and a protocol for inband control and configuration H Chen, KR Vadivelu, HL Heck US Patent 9,559,905, 2017 | 29 | 2017 |
| Impact of FR4 dielectric non-uniformity on the performance of multi-Gb/s differential signals H Heck, S Hall, B Horine, K Mallory, T Wig Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710), 243-246, 2003 | 28 | 2003 |
| Method, apparatus, and system for parallel plate mode radial pattern signaling S Hall, T Liang, H Heck, B Horine, G Brist US Patent 7,271,680, 2007 | 26 | 2007 |
| Modeling requirements for transmission lines in multi-gigabit systems S Hall, T Liang, H Heck, D Shykind Electrical Performance of Electronic Packaging-2004, 67-70, 2004 | 20 | 2004 |
| Multi-level coding for digital communication J Mix, M Leddige, H Heck US Patent App. 09/968,641, 2003 | 20 | 2003 |
| Vertical trench routing in a substrate J Kong, BE Cheah, KC Yong, HL Heck, KY Chen US Patent 10,079,158, 2018 | 18 | 2018 |
| Full characterization of substrate integrated waveguides from S-parameter measurements R Torres-Torres, G Romo, B Horine, A Sachez, H Heck 2006 IEEE Electrical Performane of Electronic Packaging, 277-280, 2006 | 18 | 2006 |
| Reducing electromagnetic interference (EMI) emissions HG Skinner, SY Chang, HL Heck, Y Ji US Patent 6,672,902, 2004 | 18 | 2004 |
| Shifted segment layout for differential signal traces to mitigate bundle weave effect T Liang, SH Hall, H Heck, GA Brist, B Horine US Patent 7,427,719, 2008 | 11 | 2008 |
| Method and apparatus of USB 3.1 retimer presence detect and index H Chen, HL Heck US Patent 9,875,210, 2018 | 10 | 2018 |
| Advanced signal integrity for high-speed digital design HH Stephen, LH Howard New York: John Wiley& Sons, 114-115, 1985 | 10 | 1985 |
| Bandwidth configurable IO connector JE Jaussi, SR Mooney, BK Casper, HL Heck US Patent 9,654,342, 2017 | 9 | 2017 |
| Rate scalable IO interface with zero stand-by power and fast start-up SR Mooney, HL Heck, JE Jaussi, BK Casper US Patent 9,791,905, 2017 | 8 | 2017 |
| Re-driver power management H Chen, H Heck US Patent 9,223,385, 2015 | 8 | 2015 |
| Electromagnetic interference waveguide shield with absorber layer S Chang, S Ji, H Skinner, H Heck US Patent App. 10/027,345, 2003 | 8 | 2003 |
Jamesina J. SimpsonProfessor of Electrical and Computer Engineering, University of UtahVerified email at utah.edu
