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Co-authors
- Alexander B. YakovlevProfessor of Electrical Engineering, University of MississippiVerified email at olemiss.edu
- Chandra S. R. KaipaQualcomm Technologies Inc.Verified email at olemiss.edu
- George HansonProfessor of Electrical Engineering, University of Wisconsin-MilwaukeeVerified email at uwm.edu
- Francisco MedinaUniversidad de Sevilla, Dept. Electronica y Electromagnetismo, Seville, SpainVerified email at us.es
- Francisco MesaUniversidad de SevillaVerified email at us.es
- Andrea AluCUNY Advanced Science Research CenterVerified email at gc.cuny.edu
- Pai-Yen ChenProfessor, Electrical and Computer Engineering, University of Illinois ChicagoVerified email at uic.edu
- Hossein Mehrpour BernetyPostdoctoral Scholar at Stanford UniversityVerified email at stanford.edu
- Salman KarbasiUniversity of California, San Diego (past), UWM (past)Verified email at ucsd.edu
- Arash MafiUniversity of KansasVerified email at ku.edu
- Stanislav I. MaslovskiPrincipal Researcher, Department of Electronics, Telecommunications, and Informatics, Aveiro Univ.Verified email at co.it.pt
- Mário SilveirinhaProfessor of Electrical Engineering, University of Lisbon, PortugalVerified email at tecnico.ulisboa.pt
- Simovski ConstantinAalto UniversityVerified email at aalto.fi
- Sergei TretyakovDepartment of Electronics and Nanoengineering, Aalto UniversityVerified email at aalto.fi
- Pavel BelovITMO UniversityVerified email at metalab.ifmo.ru
- Igor nefedovAalto University, Dept. of Electronics and NanoengineeringVerified email at aalto.fi
- Kai Fong LeeDean Emeritus, School of Engineering, University of MississippiVerified email at olemiss.edu
- Atef Z. ElsherbeniProfessor, EE Department, Colorado School of MinesVerified email at mines.edu