| Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3D Small-world Network-on-Chip S Das, JR Doppa, PP Pande, K Chakrabarty IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017 | 90 | 2017 |
| Optimizing 3D NoC design for energy efficiency: A machine learning approach S Das, JR Doppa, DH Kim, PP Pande, K Chakrabarty 2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 705-712, 2015 | 73 | 2015 |
| Performance and Thermal Trade-Offs for Energy Efficient Monolithic 3D Network-on-Chip D Lee, S Das, JR Doppa, PP Pande, K Chakrabarty To appear in ACM Transaction on Design and Automation of Electronic System …, 2018 | 50 | 2018 |
| Monolithic 3D-enabled High Performance and Energy Efficient Network-on-Chip S Das, JR Doppa, PP Pande, K Chakravarty 35th IEEE International Conference on Computer Design, 2017, 233-240, 2017 | 45 | 2017 |
| Automated detection of optic disc and blood vessel in retinal image using morphological, edge detection and feature extraction technique NC Mithun, S Das, SA Fattah International Conference Computer and Information Technology (ICCIT), 98-102, 2014 | 27 | 2014 |
| Energy-Efficient and Reliable 3D Network-on-Chip (NoC): Architectures and Optimization Algorithms S Das, JR Doppa, PP Pande, K Chakrabarty Computer-Aided Design (ICCAD), 2016 IEEE/ACM International Conference on, 1-6, 2016 | 25 | 2016 |
| Impact of electrostatic coupling on monolithic 3D-enabled network on chip D Lee, S Das, JR Doppa, PP Pande, K Chakrabarty ACM Transactions on Design Automation of Electronic Systems (TODAES) 24 (6 …, 2019 | 21 | 2019 |
| Small-world network enabled energy efficient and robust 3D NoC architectures S Das, D Lee, DH Kim, PP Pande Proceedings of the 25th edition on Great Lakes Symposium on VLSI, 133-138, 2015 | 20 | 2015 |
| Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC S Gopal, S Das, D Heo, PP Pande To appear on 11th International Symposium on Networks-on-Chip (NOCS), 2017, 2017 | 16 | 2017 |
| Abetting Planned Obsolescence by Aging 3D Networks-on-Chip S Das, K Basu, JR Doppa, PP Pande, R Karri, K Chakrabarty To appear in Proceedings of IEEE/ACM International Symposium on Networks-on …, 2018 | 15 | 2018 |
| High-Performance and Small-Form Factor Near Field Inductive Coupling for 3D NoC S Gopal, S Das, P Agarwal, SN Ali, D Heo, PP Pande IEEE Transactions on Very Large Scale Integration (VLSI) Systems., 2018 | 14 | 2018 |
| Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architecture D Lee, S Das, PP Pande INTEGRATION the VLSI journal, 2018 | 13 | 2018 |
| Reliability and performance trade-offs for 3D NoC-enabled multicore chips S Das, JR Doppa, PP Pande, K Chakrabarty 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2016 | 12 | 2016 |
| Robust TSV-based 3D NoC Design to Counteract Electromigration and Crosstalk Noise S Das, JR Doppa, PP Pande, K Chakrabarty Proceedings of Design, Automation and Test in Europe (DATE), 2017, 2017 | 11 | 2017 |
| Posterior reversible encephalopathy syndrome in a patient with lupus nephritis on rituximab therapy: a challenge to find the offender S Mondal, RP Goswami, D Sinha, K Basu, S Das, P Ghosh, A Ghosh Lupus 25 (4), 445-446, 2016 | 10 | 2016 |
| Microplastics contamination in two species of gobies and their estuarine habitat of Indian Sundarbans NH Chatterjee, S Manna, A Ray, S Das, N Rana, A Banerjee, M Ray, ... Marine Pollution Bulletin 198, 115857, 2024 | 8 | 2024 |
| Flexible triboelectric nanogenerators of Au-g-C3N4/ZnO hierarchical nanostructures for machine learning enabled body movement detection SP Das, R Bhuyan, B Baro, U Das, R Sharma, S Bayan Nanotechnology 34 (44), 445501, 2023 | 8 | 2023 |
| A PVT-Resilient No-Touch DFT Methodology for Prebond TSV Testing S Das, F Su, S Chakravarty To appear in Proceedings of International Test Conference (ITC), 2018 | 8 | 2018 |
| Low cost smart-glass using ESP-32 S Das, S Saxena, NK Rout 2021 IEEE 2nd International Conference on Applied Electromagnetics, Signal …, 2021 | 7 | 2021 |
| A Hybrid 3D Interconnect with 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC S Gopal, S Das, PP Pande, D Heo IEEE Symposium on Integrated Circuits and Systems, 2020 | 7 | 2020 |
Partha PandeWashington State UniversityVerified email at wsu.edu
