Emerging terahertz integrated systems in silicon X Yi, C Wang, Z Hu, JW Holloway, MIW Khan, MI Ibrahim, M Kim, ... IEEE Transactions on Circuits and Systems I: Regular Papers 68 (9), 3537-3550, 2021 | 55 | 2021 |
Innovations in terahertz interconnects: High-speed data transport over fully electrical terahertz waveguide links JW Holloway, GC Dogiamis, R Han IEEE microwave magazine 21 (1), 35-50, 2019 | 54 | 2019 |
Electronic THz Pencil Beam Forming and 2D Steering for High Angular-Resolution Operation: A 98 98-Unit 265GHz CMOS Reflectarray with In-Unit Digital Beam … NM Monroe, GC Dogiamis, R Stingel, P Myers, X Chen, R Han 2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 1-3, 2022 | 42 | 2022 |
11.9 A 105Gb/s dielectric-waveguide link in 130nm BiCMOS using channelized 220-to-335GHz signal and integrated waveguide coupler JW Holloway, GC Dogiamis, R Han 2021 IEEE International Solid-State Circuits Conference (ISSCC) 64, 196-198, 2021 | 39 | 2021 |
220-to-330-GHz manifold triplexer with wide stopband utilizing ridged substrate integrated waveguides JW Holloway, GC Dogiamis, S Shin, R Han IEEE Transactions on Microwave Theory and Techniques 68 (8), 3428-3438, 2020 | 36 | 2020 |
Convolution inference via synchronization of a coupled CMOS oscillator array DE Nikonov, P Kurahashi, JS Ayers, H Li, T Kamgaing, GC Dogiamis, ... IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 6 …, 2020 | 25 | 2020 |
A fully integrated 160Gb/s D-band transmitter with 1.1 pJ/b efficiency in 22nm FinFET technology S Callender, A Whitcombe, A Agrawal, R Bhat, M Rahman, CC Lee, ... 2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 78-80, 2022 | 24 | 2022 |
A 120-Gb/s 100–145-GHz 16-QAM dual-band dielectric waveguide interconnect with package integrated diplexers in Intel 16 GC Dogiamis, TW Brown, NP Gaunkar, YS Nam, TS Rane, S Ravikumar, ... IEEE Solid-State Circuits Letters 5, 178-181, 2022 | 22 | 2022 |
A fully integrated 160-Gb/s D-band transmitter achieving 1.1-pJ/b efficiency in 22-nm FinFET S Callender, A Agrawal, A Whitcombe, R Bhat, M Rahman, CC Lee, ... IEEE Journal of Solid-State Circuits 57 (12), 3582-3598, 2022 | 20 | 2022 |
A 50-Gb/s 134-GHz 16-QAM 3-m dielectric waveguide transceiver system implemented in 22-nm FinFET CMOS TW Brown, GC Dogiamis, YS Yeh, D Correas-Serrano, TS Rane, ... IEEE Solid-State Circuits Letters 4, 206-209, 2021 | 18 | 2021 |
mmWave and sub-THz technology development in Intel 22nm FinFET (22FFL) process Q Yu, S Rami, J Waldemer, Y Ma, V Neeli, J Garrett, G Liu, J Koo, ... 2020 IEEE International Electron Devices Meeting (IEDM), 17.4. 1-17.4. 4, 2020 | 12 | 2020 |
A low-power FSK/spatial modulation transmitter for mm-wave wireless links K Zhan, J Kang, G Wang, T Kamgaing, R Khanna, G Dogiamis, H Liu, ... 2017 IEEE MTT-S International Microwave Symposium (IMS), 801-804, 2017 | 11 | 2017 |
Investigations on an ultra-thin bendable monolithic Si CMOS image sensor GC Dogiamis, BJ Hosticka, A Grabmaier IEEE Sensors Journal 13 (10), 3892-3900, 2013 | 10 | 2013 |
An F-band power amplifier with skip-layer via achieving 23.8% PAE in FinFET technology Q Yu, J Garrett, S Hwangbo, G Dogiamis, S Rami 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 179-182, 2022 | 8 | 2022 |
A 50 Gbps 134 GHz 16 QAM 3 m dielectric waveguide transceiver system implemented in 22nm CMOS TW Brown, GC Dogiamis, YS Yeh, D Correas-Serrano, TS Rane, ... 2021 Symposium on VLSI Circuits, 1-2, 2021 | 8 | 2021 |
A 60-Gbps 108-GHz 16-QAM dielectric waveguide interconnect with package integrated filters GC Dogiamis, TW Brown, NP Gaunkar, YS Nam, TS Rane, S Ravikumar, ... 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 556-559, 2022 | 7 | 2022 |
CMOS transistors under uniaxial stress on ultra-thin chips for applications in bendable image sensors J Häfner, W Mokwa, G Dogiamis, B Hosticka, A Grabmaier PRIME 2012; 8th Conference on Ph. D. Research in Microelectronics …, 2012 | 6 | 2012 |
An ultra-thin bendable Si-monolithic imaging test sensor GC Dogiamis, J Haefner, W Mokwa, BJ Hosticka, A Grabmaier 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 4 | 2013 |
A Low-Power FSK/Spatial Modulation Receiver for Short-Range mm-Wave Wireless Links K Zhan, Y Liu, T Kamgaing, R Khanna, G Dogiamis, H Liu, A Natarajan 2019 IEEE MTT-S International Microwave Symposium (IMS), 492-495, 2019 | 3 | 2019 |
Theoretical considerations of the influence of mechanical uniaxial stress on pixel readout circuits GC Dogiamis, BJ Hosticka, A Grabmaier International Journal of Electronics and Communication Engineering 6 (6 …, 2012 | 3 | 2012 |