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Dogiamis Georgios
Dogiamis Georgios
Verified email at intel.com
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Year
Emerging terahertz integrated systems in silicon
X Yi, C Wang, Z Hu, JW Holloway, MIW Khan, MI Ibrahim, M Kim, ...
IEEE Transactions on Circuits and Systems I: Regular Papers 68 (9), 3537-3550, 2021
552021
Innovations in terahertz interconnects: High-speed data transport over fully electrical terahertz waveguide links
JW Holloway, GC Dogiamis, R Han
IEEE microwave magazine 21 (1), 35-50, 2019
542019
Electronic THz Pencil Beam Forming and 2D Steering for High Angular-Resolution Operation: A 98 98-Unit 265GHz CMOS Reflectarray with In-Unit Digital Beam …
NM Monroe, GC Dogiamis, R Stingel, P Myers, X Chen, R Han
2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 1-3, 2022
422022
11.9 A 105Gb/s dielectric-waveguide link in 130nm BiCMOS using channelized 220-to-335GHz signal and integrated waveguide coupler
JW Holloway, GC Dogiamis, R Han
2021 IEEE International Solid-State Circuits Conference (ISSCC) 64, 196-198, 2021
392021
220-to-330-GHz manifold triplexer with wide stopband utilizing ridged substrate integrated waveguides
JW Holloway, GC Dogiamis, S Shin, R Han
IEEE Transactions on Microwave Theory and Techniques 68 (8), 3428-3438, 2020
362020
Convolution inference via synchronization of a coupled CMOS oscillator array
DE Nikonov, P Kurahashi, JS Ayers, H Li, T Kamgaing, GC Dogiamis, ...
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits 6 …, 2020
252020
A fully integrated 160Gb/s D-band transmitter with 1.1 pJ/b efficiency in 22nm FinFET technology
S Callender, A Whitcombe, A Agrawal, R Bhat, M Rahman, CC Lee, ...
2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 78-80, 2022
242022
A 120-Gb/s 100–145-GHz 16-QAM dual-band dielectric waveguide interconnect with package integrated diplexers in Intel 16
GC Dogiamis, TW Brown, NP Gaunkar, YS Nam, TS Rane, S Ravikumar, ...
IEEE Solid-State Circuits Letters 5, 178-181, 2022
222022
A fully integrated 160-Gb/s D-band transmitter achieving 1.1-pJ/b efficiency in 22-nm FinFET
S Callender, A Agrawal, A Whitcombe, R Bhat, M Rahman, CC Lee, ...
IEEE Journal of Solid-State Circuits 57 (12), 3582-3598, 2022
202022
A 50-Gb/s 134-GHz 16-QAM 3-m dielectric waveguide transceiver system implemented in 22-nm FinFET CMOS
TW Brown, GC Dogiamis, YS Yeh, D Correas-Serrano, TS Rane, ...
IEEE Solid-State Circuits Letters 4, 206-209, 2021
182021
mmWave and sub-THz technology development in Intel 22nm FinFET (22FFL) process
Q Yu, S Rami, J Waldemer, Y Ma, V Neeli, J Garrett, G Liu, J Koo, ...
2020 IEEE International Electron Devices Meeting (IEDM), 17.4. 1-17.4. 4, 2020
122020
A low-power FSK/spatial modulation transmitter for mm-wave wireless links
K Zhan, J Kang, G Wang, T Kamgaing, R Khanna, G Dogiamis, H Liu, ...
2017 IEEE MTT-S International Microwave Symposium (IMS), 801-804, 2017
112017
Investigations on an ultra-thin bendable monolithic Si CMOS image sensor
GC Dogiamis, BJ Hosticka, A Grabmaier
IEEE Sensors Journal 13 (10), 3892-3900, 2013
102013
An F-band power amplifier with skip-layer via achieving 23.8% PAE in FinFET technology
Q Yu, J Garrett, S Hwangbo, G Dogiamis, S Rami
2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 179-182, 2022
82022
A 50 Gbps 134 GHz 16 QAM 3 m dielectric waveguide transceiver system implemented in 22nm CMOS
TW Brown, GC Dogiamis, YS Yeh, D Correas-Serrano, TS Rane, ...
2021 Symposium on VLSI Circuits, 1-2, 2021
82021
A 60-Gbps 108-GHz 16-QAM dielectric waveguide interconnect with package integrated filters
GC Dogiamis, TW Brown, NP Gaunkar, YS Nam, TS Rane, S Ravikumar, ...
2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 556-559, 2022
72022
CMOS transistors under uniaxial stress on ultra-thin chips for applications in bendable image sensors
J Häfner, W Mokwa, G Dogiamis, B Hosticka, A Grabmaier
PRIME 2012; 8th Conference on Ph. D. Research in Microelectronics …, 2012
62012
An ultra-thin bendable Si-monolithic imaging test sensor
GC Dogiamis, J Haefner, W Mokwa, BJ Hosticka, A Grabmaier
2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013
42013
A Low-Power FSK/Spatial Modulation Receiver for Short-Range mm-Wave Wireless Links
K Zhan, Y Liu, T Kamgaing, R Khanna, G Dogiamis, H Liu, A Natarajan
2019 IEEE MTT-S International Microwave Symposium (IMS), 492-495, 2019
32019
Theoretical considerations of the influence of mechanical uniaxial stress on pixel readout circuits
GC Dogiamis, BJ Hosticka, A Grabmaier
International Journal of Electronics and Communication Engineering 6 (6 …, 2012
32012
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