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Co-authors
- Nelson TansuHead of School & Professor, School of Electrical & Mechanical Engineering [EEE, ME, & BME]Verified email at adelaide.edu.au
- Hongping ZhaoProfessor of Electrical & Computer Engineering, Materials Science & Engineering, OSUVerified email at osu.edu
- Jing ZhangAssociate Professor, Rochester Institute of TechnologyVerified email at rit.edu
- Boon S. OoiKing Abdullah University of Science & Technology (KAUST)Verified email at kaust.edu.sa
- Tien Khee NgPrincipal Scientist, KAUST; Fellow of IET, Fellow of IOPVerified email at kaust.edu.sa
- Xiaohang LiAssociate Professor, Advanced Semiconductor Lab, ECE, CEMSEVerified email at kaust.edu.sa
- Volkmar DierolfLehigh UniversityVerified email at lehigh.edu
- Jonathan D. PoplawskyOak Ridge National LaboratoryVerified email at ornl.gov
- Ronald ArifLehigh University, II-VI, Cree, Veeco, ThermoFisherVerified email at thermofisher.com
- Chun Hong KangKing Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
- Chao ShenFudan UniversityVerified email at kaust.edu.sa
- Chee-Keong TanAssistant Professor, Hong Kong University of Science and Technology (Guangzhou)Verified email at ust.hk
- Prof. Mohamed-Slim AlouiniWireless CT Lab, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi ArabiaVerified email at kaust.edu.sa
- Kang-Ting HoKAUSTVerified email at kaust.edu.sa
- Hassan Makine OubeiKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- Peifen ZhuUniversity of MissouriVerified email at missouri.edu
- Jim SpeckProfessor of Materials, UCSBVerified email at ucsb.edu
- Davide PrianteCoherent Corp.Verified email at unm.edu
- Chao ZhaoProfessor, Institute of Semiconductors, Chinese Academy of Sciences; Fellow of IOPVerified email at semi.ac.cn
- Mohamed EbaidBerkeley LabVerified email at lbl.gov