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HARSH SHARMA
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SWAP: A server-scale communication-aware chiplet-based manycore PIM accelerator
H Sharma, SK Mandal, JR Doppa, UY Ogras, PP Pande
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2022
202022
Florets for Chiplets: Data Flow-aware High-Performance and Energy-efficient Network-on-Interposer for CNN Inference Tasks
H Sharma, L Pfromm, RO Topaloglu, JR Doppa, UY Ogras, ...
ACM Transactions on Embedded Computing Systems 22 (5s), 1-21, 2023
62023
Achieving datacenter-scale performance through chiplet-based manycore architectures
H Sharma, SK Mandal, JR Doppa, U Ogras, PP Pande
2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023
62023
A Heterogeneous Chiplet Architecture for Accelerating End-to-End Transformer Models
H Sharma, P Dhingra, JR Doppa, U Ogras, PP Pande
arXiv preprint arXiv:2312.11750, 2023
52023
Science on a stick: An experimental and demonstration platform for learning several physical principles
DV Gadre, H Sharma, SD Gadre, S Srivastava
American Journal of Physics 91 (2), 116-121, 2023
32023
Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5 D Chiplet Platforms and Beyond
J Park, A Kanani, L Pfromm, H Sharma, P Solanki, E Tervo, JR Doppa, ...
2024 IEEE 42nd VLSI Test Symposium (VTS), 1-4, 2024
12024
Dataflow-Aware PIM-Enabled Manycore Architecture for Deep Learning Workloads
H Sharma, G Narang, JR Doppa, U Ogras, PP Pande
2024 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2024
12024
A Dataflow-Aware Network-on-Interposer for CNN Inferencing in the Presence of Defective Chiplets
H Sharma, U Ogras, A Kalyanraman, PP Pande
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2024
2024
MFIT: Multi-Fidelity Thermal Modeling for 2.5 D and 3D Multi-Chiplet Architectures
L Pfromm, A Kanani, H Sharma, P Solanki, E Tervo, J Park, JR Doppa, ...
arXiv preprint arXiv:2410.09188, 2024
2024
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